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High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III

Chengdu Cesgate Technology Co., Ltd
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    Buy cheap High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III from wholesalers
     
    Buy cheap High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III from wholesalers
    • Buy cheap High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III from wholesalers
    • Buy cheap High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III from wholesalers

    High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III

    Ask Lasest Price
    Brand Name : CESGATE
    Model Number : NA
    Certification : UL、IATF16949、ISO9001
    Price : Negotiable (Depends on your GERBER and BOM)
    Payment Terms : T/T, L/C
    Supply Ability : 13kk solding spot/day
    Delivery Time : 3-7 working days
    • Product Details
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    High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III

    High frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III


    CESGATE's advantages of turnkey PCB assembly


    As IATF16949 verified circuit board factory, CESGATE will provide DFM Analysis for your every order , as well as low volume and medium volume production runs. We verify all details of your files, including Gerber files, to allow you to correct your PCB design before manufacturing, saving significant time and cost.
    We use ERP and MES system, which can protect all your project files and also control all the parts quality from the beginning to the end . As a PCB manufacturer, we have complete and mature tracking system by the two systems, which can solve the problems quickly, also guarantees on-time delivery of quick turn printed circuit board.


    Rigid-flex board refers to pressing the flexible circuit board and the rigid circuit board together according to the relevant process requirements during PCB proofing to form a circuit board with FPC characteristics and PCB characteristics; its price is relatively high, but its use Extremely broad and can be tailored for applications in many industries. So, under what circumstances does PCB proofing need to use rigid-flex board?
    1. High impact and high vibration environment. The rigid-flex board has strong impact resistance and can be used in high stress environments to ensure stable performance of the equipment, otherwise it will cause equipment failure.
    2. High-precision applications where reliability is more important than cost considerations. If a cable or connector failure is dangerous, it is better to use a more durable flex-rigid board.
    3. High density applications. Some components lack the surface area required for all necessary connectors and cables. In this case, using a flexible rigid board can save space to solve this problem.
    4. Applications requiring multiple rigid boards. When more than four connection boards are included in the Turnkey PCB Assembly, replacing them with a single rigid-flex board may be the best option and more cost-effective.


    CESGATE advantages?


    In the PCB industry for more than ten years, a standardized and rigorous process and system has been established to effectively reduce quality problems


    Specification


    ArticleDescriptionCapability
    MaterialLaminate materialsFR4, High TG FR4, High Frequency, Alum, FPC...
    Board CuttingNumber of layers1-48
    Min.thickness for inner layers
    (Cu thickness are excluded)
    0.003”(0.07mm)
    Board ThicknessStandard(0.1-4mm±10%)
    Min.Single/Double:0.008±0.004”
    4layer:0.01±0.008”
    8layer:0.01±0.008”
    Bow and twistno more than 7/1000
    Copper WeightOuter Cu weight0.5-4 0z
    Inner Cu weight0.5-3 0z
    DrillingMin size0.0078”(0.2mm)
    Drill deviation±0.002″(0.05mm)
    PTH hole tolerance±0.002″(0.005mm)
    NPTH hole tolerance±0.002″(0.005mm)
    Solder MaskColorGreen,white,black,red,blue…
    Min solder mask clearanace0.003″(0.07mm)
    Thickness(0.012*0.017mm)
    SilkscreenColorwhite,black,yellow,blue…
    Min size0.006″(0.15mm)
    Max Size of Finish Board700*460mm
    Surface FinishHASL,ENIG,immersion silver,immersion tin,OSP…
    PCB OutlineSquare,circle,irregular(with jigs)
    PackageQFN,BGA,SSOP,PLCC,LGA

    High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class IIIHigh Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class IIIHigh Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class IIIHigh Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III


    FAQ


    Q: Do you support fast proofing?
    CESGATE: Yes, we support fast proofing within 3-7 days.
    Q: Are my files safe?
    CEGSATE: Your files are kept very safe, and we are protecting intellectual property for our clients throughout the process. All files provided by customers are never shared with any third party.
    Q: MOQ?
    CESGATE: There is no MOQ in POE. We are able to flexibly handle small and large batches.
    Q: Do you have any other services?
    CESGATE: We mainly focus on the procurement services of PCB + Turnkey PCB Assembly+ components. In addition, we can also provide programming, testing, cable, housing Turnkey PCB Assembly services.
    Q: What is your inspection policy? How do you control the quality?
    CESGATE: In order to ensure the quality of PCB products, flying probe inspection is usually used; electrical fixtures, automatic optical inspection (AOI), BGA parts x-ray inspection, first article inspection ( FAI) etc.
    Quality High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III for sale
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